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CHEMICAL NI IPT-S

  • Alkaline-type electroless copper plating solution
    Can obtain high P content film (P content: 8 to 10%)
    High corrosion resistance
    Prevent nickel film dissolution aroung contact points
    Excellent in selective deposition performance
    Prevent the deposition to jigs
    Can decrease nickel concentration, economical product
  • Alkaline Type Electroless Nickel Plating Solution
  • ABS, PC/ABS