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  • Decorative Plating
  • Pretreatment Agent for Plastics
  • Electroless Nickel Plating Solution
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  • CHEMICAL NICKEL(A CONC, B CONC)

    • Use only for replenishing to increase chemical nickel concentration
      Can reduce drag-out amount just after replenishing
      Effective in terms of wastewater treatment and production costs
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS, Nonconductor, General plastics
  • CHEMICAL NICKEL RS

    • Lead-free, RoHS compliant product
      Use for substances that can't be plated easily
      Concentrated product to reduce chemical consumption
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS, Nonconductor, General plastics
  • CHEMICAL NICKEL

    • Excellent in bath stability for a long time use
      High-speed deposition, film brightness can be maintained
      Not easily damaded by scratched, prevent burnt deposition
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS, Nonconductor, General plastics
  • TMP KINKORON

    • Prevent mold and bacterium occurrence in alkaline electroless nickel plating solutions
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS, Nonconductor, General plastics
  • CHEMICAL NICKEL INHIBITOR

    • Add into electroless nickel plating solutions
      Improve plating selectivity to two-color molded parts
      Prevent deposition on plating tanks and jigs
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS, General plastics, Nonconductor
  • CHEMICAL NI IPT-S

    • Alkaline-type electroless copper plating solution
      Can obtain high P content film (P content: 8 to 10%)
      High corrosion resistance
      Prevent nickel film dissolution aroung contact points
      Excellent in selective deposition performance
      Prevent the deposition to jigs
      Can decrease nickel concentration, economical product
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS
  • CHEMICAL NI IPT

    • Alkaline-type electroless copper plating solution
      Can obtain high P content film (P content: 8 to 10%)
      High corrosion resistance
      Prevent nickel film dissolution aroung contact points
      Excellent in selective deposition performance
      Prevent the deposition to jigs
      Can decrease nickel concentration, economical product
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS
  • CHEMICAL NICKEL AFS

    • Alkaline-type electroless nickel plating solution
      Ammonia-free, excellent in corrosion resistance
      Prevent conductivity failure caused by no deposition on jigs
      Control electroplating film dissolution
      No need to increase the thickness of electroless nickel plating films
      (High P content, P content 8 to 10%)
    • Alkaline Type Electroless Nickel Plating Solution
    • ABS, PC/ABS