TOTAL
PROCESS토탈 프로세스

오쿠노제약공업의 표면처리 약품, 무기 재료는, 스마트폰, 반도체, 전자 부품, 자동차, 기계 부품 등에 폭 넓게 사용되고 있습니다.
프린트 배선판, 양극 산화(아노다이징), 플라스틱 도금, 무전해도금, 전기 도금 등 표면처리를 맡겨 주십시오.
오쿠노제약공업은 시작부터 양산까지, 표면 처리를 전체적으로 서포트합니다.

  • Electroless plating process applicable to UBM formation for aluminum electrodes on wafers

    Electroless plating process applicable to UBM formation for aluminum electrodes on wafers

    • Electroless plating process applicable to UBM formation for aluminum electrodes on wafers
    • We have developed the "TORYZA EL PROCESS", a plating process for forming UBM for aluminum electrodes on wafers. We can provide a variety of plating chemicals and solutions for semiconductor industries.
    • Si wafer, SiC wafer

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  • OKUNO's process for the manufacture of semiconductor package substrates

    OKUNO's process for the manufacture of semiconductor package substrates

    • We provide many plating chemicals from pre-treatment to post-treatment for the manufacturing of IC substrates and interposers by semi additive process (SAP).
    • IC substrates, plastic semiconductor substrates, plastic interposers for CPU, GPU and other semiconductor devices
    • Build-up printed wiring boards

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  • Electroless plating process for Direct Copper Bonding (DCB) dielectric ceramic substrates

    Electroless plating process for Direct Copper Bonding (DCB) dielectric ceramic substrates

    • We offer a wide range of processing chemicals, primarily focusing on plating solutions for Direct Copper Bonding (DCB) dielectric ceramic substrates, which feature high thermal conductivity and electrical conductivity on ceramics.
    • Heat radiating dielectric ceramic substrates
    • Ceramic substrate, AlN （Aluminum Nitride）substrate

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  • Electroless plating process for Aluminum Active Metal Brazed (AMB) dielectric ceramic substrates

    Electroless plating process for Aluminum Active Metal Brazed (AMB) dielectric ceramic substrates

    • We offer a wide range of processing chemicals, primarily focusing on plating solutions for Aluminum Active Metal Brazed (AMB) dielectric ceramic substrates, which feature high heat radiation property.
    • Heat radiating dielectric ceramic substrates
    • Ceramic substrate, AlN （Aluminum Nitride）substrate

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  • Anodizing and dyeing process for aluminum surface and color designs

    Anodizing and dyeing process for aluminum surface and color designs

    • We provide our customers all of aluminum-related chemicals from pre-treatment to post-treatment as a total process to create new added value for aluminum.
    • Smartphones, computers, music player, cameras
    • Aluminum alloys

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  • Contribute PWB(PCB) fabrication by OKUNO’s total solutions

    Contribute PWB(PCB) fabrication by OKUNO’s total solutions

    • We have wide product line-up, mainly for plating process to PWB/PCBs from pre-treatment to post-treatment.
    • Consumer electronics
    • CCL; Copper Clad Laminate

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  • Decorative plating process for plastic

    Decorative plating process for plastic

    • You will find plastic on plastic technology around us that realizes metallic, beautiful and luxurious feelings on plastic parts. It is widely used for the designs of motorcycle, bicycle, bathroom, interior parts, faucet fittings and many home appliances.
    • Motorcycle, bicycle, bathroom, interior parts, faucet fittings and many home appliances
    • ABS, PC/ABS

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